Dow has developed BETAFORCE™ structural bonding adhesives which are specifically formulated to assemble and seal the battery packs. These adhesives used for battery pack assemblies ensure the durability & long-life and contribute to lighter weight in EVs and HEVs.
Christophe Van Herreweghe, Marketing Manager – Body & Exteriors, Dow Automotive Systems said:
“Dow Automotive Systems has been a leader in bonding technologies for vehicle assembly for over 55 years. It’s natural that this expertise extends to solutions for the rapidly growing HEV and EV market.”
Thermally Conductive Adhesives by Dow
A broad portfolio includes a range of benefits such as:
High modulus with the ability for heat acceleration
Latency to address different process conditions
And many more…
BETAFORCE™ TC two-part, thermal-conductive adhesive, for example, demonstrates ease of dispensability, temperature management characteristics and low abrasiveness – all of which are important in electronic componentry assembly.
Developing Silicone-free, Thermal-conductive Gap-filling Technology
Dow is sharing its proven technology with a fast-evolving market eager for reliable partners by working with OEMs, Tiers and battery manufacturers.
Demonstrating its development expertise, Dow also is working on an organic, silicone-free, thermal-conductive gap-filling technology. This is currently in the customer evaluation stage with commercialization to be announced at a later date.